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d a t a sh eet product speci?cation supersedes data of 1999 may 20 file under integrated circuits, ic03 1999 oct 14 integrated circuits tea1098 speech and handsfree ic
1999 oct 14 2 philips semiconductors product speci?cation speech and handsfree ic tea1098 features line interface low dc line voltage voltage regulator with adjustable dc voltage symmetrical high impedance inputs (70 k w ) for dynamic, magnetic or electret microphones dtmf input with confidence tone on earphone and/or loudspeaker receive amplifier for dynamic, magnetic or piezo-electric earpieces (with externally adjustable gain) automatic gain control (agc) for true line loss compensation. supplies provides a strong 3.35 v regulated supply for microcontrollers or diallers provides filtered power supply, optimized according to line current filtered 2.0 v power supply output for electret microphone pd logic input for power-down. handsfree asymmetrical high input impedance for electret microphone loudspeaker amplifier with single-ended rail-to-rail output and externally adjustable gain dynamic limiter on loudspeaker amplifier to prevent distortion logarithmic volume control on loudspeaker amplifier via linear potentiometer duplex controller consisting of: C signal and noise envelope monitors for both channels (with adjustable sensitivities and timing) C decision logic (with adjustable switch-over and idle mode timing) C voice switch control (with adjustable switching range and constant sum of gain during switching). applications line powered telephone sets. general description the tea1098 is an analog bipolar circuit dedicated to telephony applications. it includes a line interface, handset (hs) microphone and earpiece amplifiers, handsfree (hf) microphone and loudspeaker amplifiers and a duplex controller with signal and noise monitors on both channels. this ic provides a 3.35 v supply for a microcontroller or dialler and a 2.0 v filtered voltage supply for an electret microphone. ordering information type number package name description version tea1098tv vso40 plastic very small outline package; 40 leads sot158-1 TEA1098H qfp44 plastic quad ?at package; 44 leads (lead length 1.3 mm); body 10 10 1.75 mm sot307-2 tea1098uh - bare die; on foil -
1999 oct 14 3 philips semiconductors product speci?cation speech and handsfree ic tea1098 quick reference data i line = 15 ma; r slpe =20 w ; z line = 600 w ; f = 1 khz; t amb =25 c for TEA1098H and tea1098tv; t j =25 c for tea1098uh; agc pin connected to ln; pd = high; hfc = low; mute = high; measured according to test circuits; unless otherwise speci?ed. symbol parameter conditions min. typ. max. unit i line line current operating range normal operation 11 - 130 ma with reduced performance 1 - 11 ma v slpe stabilized voltage between slpe and gnd i line = 15 ma 3.4 3.7 4.0 v i line = 70 ma 5.7 6.1 6.5 v v bb regulated supply voltage for internal circuitry i line = 15 ma 2.75 3.0 3.25 v i line = 70 ma 4.9 5.3 5.7 v v dd regulated supply voltage on pin v dd v bb > 3.35 v + 0.25 v (typ.) 3.1 3.35 3.6 v otherwise - v bb - 0.25 - v i bb current available on pin v bb in speech mode - 11 - ma in handsfree mode - 9 - ma i bb(pd) current consumption on v bb during power-down phase pd = low - 460 -m a g v(mic-ln) voltage gain from pin mic+/mic - to ln v mic = 5 mv (rms) 43.3 44.3 45.3 db g v(ir-reco) voltage gain from pin ir (referenced to ln) to reco v ir = 8 mv (rms) 28.7 29.7 30.7 db d g v(qr) gain voltage range between pins reco and qr - 3 - +15 db g v(txin-txout) voltage gain from pin txin to txout v txin = 3 mv (rms); r gatx = 30.1 k w 12.7 15.2 17.7 db g v(hftx-ln) voltage gain from pin hftx to ln v hftx = 15 mv (rms) 33.5 34.7 35.9 db g v(hfrx-lsao ) voltage gain from pin hfrx to lsao v hfrx = 30 mv (rms); r gals = 255 k w ; i line =70ma 25.5 28 30.5 db swra switching range - 40 - db d swra switching range adjustment with r swr referenced to 365 k w - 40 - +12 db d g v(trx) gain control range for transmit and receive ampli?ers affected by the agc; with respect to i line =15ma i line = 70 ma 5.45 6.45 7.45 db
1999 oct 14 4 philips semiconductors product speci?cation speech and handsfree ic tea1098 block diagram mgl317 line current detection low voltage behaviour supply management switch starter agc gnd v bb v dd mics pd agc ln 18 (15) 21 (18) 16 (13) 39 (36) 35 (32) 34 (31) 33 (30) 31 (28) 8 (4) 7 (3) 6 (2) 9 (5) 11 (7) 10 (6) 14 (11) 15 (12) 12 (8) 38 (35) (17) 20 (1) 5 (23) 26 (22) 25 (21) 24 (25) 28 (24) 27 (29) 32 (26) 29 (27) 30 (39) 2 (37) 40 (38) 1 (20) 23 (19) 22 (10) 13 37 (34) 36 (33) reg 19 (16) 17 (14) slpe tail currents for preamps power-down current sources attenuator hftx mic + mic - dtmf logic inputs decoding hfc mute gatx txout swt gndtx txin tea1098 tx and rx envelope and noise detectors tsen tenv tnoi rnoi renv rsen lsao gals buffers and comparators duco logic swt status voice switch volume control idt stab swr vol hfrx attenuator dlc dynamic limiter ir reco qr garx r1 fig.1 block diagram. pin numbers in parenthesis apply to the TEA1098H. pin numbers not in parenthesis apply to the tea1098tv.
1999 oct 14 5 philips semiconductors product speci?cation speech and handsfree ic tea1098 pinning symbol pin pad description tea1098tv TEA1098H tea1098uh pd 1 38 41 power-down input (active low) mute 2 39 42 logic input (active low) n.c. 3 40 43 not connected n.c. 4 41 44 not connected n.c. - 42 45 not connected n.c. - 43 46 not connected n.c. - 44 47 not connected hfrx 5 1 1 receive input for loudspeaker ampli?er tnoi 6 2 2 transmit noise envelope timing adjustment tenv 7 3 3 transmit signal envelope timing adjustment tsen 8 4 4 transmit signal envelope sensitivity adjustment rnoi 9 5 5 receive noise envelope timing adjustment rsen 10 6 6 receive signal envelope sensitivity adjustment renv 11 7 7 receive signal envelope timing adjustment dlc 12 8 8 dynamic limiter capacitor for the loudspeaker ampli?er n.c. - 9 9 and 13 not connected v bb 13 10 10 stabilized supply for internal circuitry gals 14 11 11 loudspeaker ampli?er gain adjustment lsao 15 12 12 loudspeaker ampli?er output gnd 16 13 14 and 15 ground reference slpe 17 14 16 line current sense ln 18 15 17 positive line terminal reg 19 16 18 line voltage regulator decoupling ir 20 17 19 receive ampli?er input agc 21 18 20 automatic gain control/line loss compensation v dd 22 19 21 3.35 v regulated voltage supply for microcontrollers mics 23 20 22 microphone supply stab 24 21 23 reference current adjustment swr 25 22 24 switching range adjustment vol 26 23 25 loudspeaker volume adjustment swt 27 24 26 switch-over timing adjustment idt 28 25 27 idle mode timing adjustment txout 29 26 28 hf microphone ampli?er output gatx 30 27 29 hf microphone ampli?er gain adjustment txin 31 28 30 hf microphone ampli?er input gndtx 32 29 31 to 32 ground reference for microphone ampli?ers mic - 33 30 33 negative hs microphone ampli?er input mic+ 34 31 34 positive hs microphone ampli?er input
1999 oct 14 6 philips semiconductors product speci?cation speech and handsfree ic tea1098 dtmf 35 32 35 dual tone multi-frequency input qr 36 33 36 earpiece ampli?er output garx 37 34 37 earpiece ampli?er gain adjustment reco 38 35 38 receive ampli?er output hftx 39 36 39 transmit input for line ampli?er hfc 40 37 40 logic input symbol pin pad description tea1098tv TEA1098H tea1098uh handbook, halfpage tea1098tv mgl341 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 hfc hftx reco garx qr dtmf mic + mic - gndtx txin gatx txout idt swt vol swr stab mics v dd agc pd mute n.c. n.c. hfrx tnoi tenv tsen rnoi rsen renv dlc v bb gals lsao gnd slpe ln reg ir fig.2 pin configuration (tea1098tv).
1999 oct 14 7 philips semiconductors product speci?cation speech and handsfree ic tea1098 handbook, full pagewidth 1 2 3 4 5 6 7 8 9 10 11 33 32 31 30 29 28 27 26 25 24 23 12 13 14 15 16 17 18 19 20 21 22 44 43 42 41 40 39 38 37 36 35 34 TEA1098H fca020 qr dtmf mic + mic - txin gatx txout idt swt vol hfrx tnoi tenv tsen rnoi rsen dlc n.c. gals gndtx n.c. n.c. n.c. n.c. mute pd hftx reco garx n.c. hfc gnd slpe ln reg ir agc mics stab swr lsao v dd renv v bb fig.3 pin configuration (TEA1098H). functional description all data values given in this chapter are typical, except when otherwise specified. supplies l ine interface and internal supply ( pins ln, slpe, reg and v bb ) the supply for the tea1098 and its peripherals is obtained from the line. the ic generates a stabilized reference voltage (v ref ) between pins slpe and gnd. this reference voltage is equal to 3.7 v for line currents below 18 ma. when the line current rises above 45 ma, the reference voltage rises linearly to 6.1 v. for line currents below 9 ma, v ref is automatically adjusted to a lower value. the performance of the tea1098 in this so-called low voltage area is limited (see section low voltage behaviour). the reference voltage is temperature compensated. the voltage between pins slpe and reg is used by the internal regulator to generate the stabilized reference voltage and is decoupled by a capacitor connected between pins ln and reg. this capacitor, converted into an equivalent inductance realizes the set impedance conversion from its dc value (r slpe ) to its ac value (done by an external impedance). the ic regulates the line voltage at pin ln which can be calculated as follows: where: i line = line current. i x = current consumed on pin ln (approximately a few m a). i slpe = current flowing through the r slpe resistor. v ln v ref r slpe i slpe + = i slpe i line i x C =
1999 oct 14 8 philips semiconductors product speci?cation speech and handsfree ic tea1098 the preferred value for r slpe is 20 w . changing this value not only affects the dc characteristics, it also influences the transmit gains to the line, the gain control characteristic, the sidetone level, and the maximum output swing on the line. figure 4 shows that the internal circuit is supplied by pin v bb , which combined with the line interface is a strong supply point. the line current through resistor r slpe is sunk by the v bb voltage stabilizer, and is suitable for supplying a loudspeaker amplifier or any peripheral ic. voltage v bb is 3.0 v at line currents below 18 ma and rises linearly to 5.3 v when the line current rises above 45 ma. it is temperature compensated. the current switch tr1-tr2 is intended to reduce distortion of large ac line signals. current i slpe is supplied to v bb via tr1 when the voltage on pin slpe is above v bb + 0.25 v. when the voltage on pin slpe is below this value, i slpe is shunted to gnd via tr2. voltage v ref can be increased by connecting an external resistor between pins reg and slpe. for large line currents, this increase can slightly affect some dynamic performances such as maximum signal level on the line at 2% total harmonic distortion (thd). the external resistor does not affect the voltage on pin v bb ; see fig.5 for the main dc voltages. handbook, full pagewidth mgm298 tn2 tr2 tr1 e2 d1 d1 r3 r2 r1 tn1 tp1 j2 j1 e1 gnd gnd v bb from preamp gnd reg ln slpe c reg 4.7 m f r slpe 20 w fig.4 line interface principle.
1999 oct 14 9 philips semiconductors product speci?cation speech and handsfree ic tea1098 handbook, full pagewidth 0.07 0.06 8 6 2 0 0 0.01 voltages (v) 0.02 0.05 mics v dd v bb slpe ln i line (a) 0.04 0.03 4 fca049 fig.5 main dc voltages. v dd supply for microcontrollers ( pin v dd ) the voltage on the v dd supply point follows the voltage on v bb with a difference typically of 250 mv, internally limited to 3.35 v. this voltage is temperature compensated. this supply point can provide a current of up to typically 3 ma. its internal consumption stays low (a few 10 na) as long as v dd does not exceed 1.5 v (see fig.6). an external voltage can be connected to v dd with limited extra consumption on v dd (typically 100 m a). this voltage source should not be below 3.5 v or above 6 v. v bb and v dd can supply current to external circuits within the line limits, taking into account the internal current consumption. s upply for microphone ( pins mics and gndtx) the mics output can be used as a supply for an electret microphone. its voltage is equal to 2.0 v; it can source a current of up to 1 ma and has an output impedance equal to 200 w . l ow voltage behaviour for line currents below 9 ma, the reference voltage is automatically adjusted to a lower value; the v bb voltage follows the slpe voltage with a difference of 250 mv. any excess current available, other than for the purposes of dc biasing the ic, will be small. at low reference voltage, the ic has limited performance. when voltage v bb falls below 2.7 v, it is detected by the receive dynamic limiter circuit connected to pin lsao and is continuously activated, discharging the capacitor connected to pin dlc. in the dc condition, the loudspeaker is then automatically disabled below this voltage. when v bb falls below 2.5 v, the tea1098 is forced into a low voltage mode irrespective of the logic input levels. this is a speech mode with reduced performance which only enables the microphone channel (between the mic inputs and pin ln) and the earpiece amplifier. these two channels are able to deliver signals for line currents as small as 3 ma. the hfc input is tied to gnd sinking a current of typically 300 m a.
1999 oct 14 10 philips semiconductors product speci?cation speech and handsfree ic tea1098 handbook, full pagewidth 1.0 i dd (pa) 1.5 2.5 3.0 v dd (v) 2.0 10 8 10 7 10 6 10 5 10 4 10 3 10 2 10 fca050 fig.6 current consumption on v dd . p ower - down mode ( pin pd) to reduce consumption during dialling or register recall (flash), the tea1098 is provided with a power-down input ( pd). when the voltage on pin pd is low, the current consumption from v bb and v dd is reduced to typically 460 m a. therefore a capacitor of 470 m f on v bb is sufficient to power the tea1098 during pulse dialling or flash. the pd input has a pull-up structure. in this mode, the capacitor c reg is internally disconnected. transmit channels (pins mic+, mic - , dtmf, hftx and ln) h andset microphone amplifier ( pins mic+, mic - and ln) the tea1098 has symmetrical microphone inputs. the input impedance between pins mic+ and mic - is typically 70 k w . the voltage gain between pins mic+/mic - and ln is set to 44.3 db. without output limitation, the microphone input stage can accept signals of up to 18 mv (rms) at 2% thd (room temperature). the microphone inputs are biased at a voltage of one diode. automatic gain control is provided for line loss compensation. dtmf amplifier ( pins dtmf, ln and reco) the tea1098 has an asymmetrical dtmf input. the input impedance between dtmf and gnd is typically 20 k w . the voltage gain between pins dtmf and ln is set to 25.35 db. without output limitation, the input stage can accept signals of up to 180 mv (rms) at 2% thd (room temperature). when the dtmf amplifier is enabled, dialling tones may be sent on the line. these tones can be heard in the earpiece or in the loudspeaker at a low level. this is called the confidence tone. the voltage attenuation between pins dtmf and reco is typically - 16.5 db. this input is dc biased at 0 v. the automatic gain control has no effect on these channels.
1999 oct 14 11 philips semiconductors product speci?cation speech and handsfree ic tea1098 h andsfree transmit amplifier ( pins hftx and ln) the tea1098 has an asymmetrical hftx input, which is mainly intended for use in combination with the txout output. the input impedance between hftx and gnd is typically 20 k w . the voltage gain between pins hftx and ln is set to 34.7 db. without output limitation, the input stage can accept signals of up to 95 mv (rms) at 2% thd (room temperature). the hftx input is biased at a voltage of two diodes. automatic gain control is provided for line loss compensation. receive channels (pins ir, reco, garx and qr) rx amplifier ( pins ir and reco) the receive amplifier has one input (ir) which is referenced to the line. the input impedance between pins ir and ln is typically 20 k w and the dc bias between these pins is equal to the voltage of one diode. the gain between pins ir (referenced to ln) and reco is typically 29.7 db. without output limitation, the input stage can accept signals of up to 50 mv (rms) at 2% thd (room temperature). the receive amplifier has a rail-to-rail output (reco), which is designed for use with high ohmic (real) loads of more than 5 k w . this output is biased at a voltage of two diodes. automatic gain control is provided for line loss compensation. e arpiece amplifier ( pins garx and qr) the earpiece amplifier is an operational amplifier which has an output (qr) and an inverting input (garx). its input signal is fed by a decoupling capacitor from the receive amplifier output (reco) to two resistors which set the required gain or attenuation from - 3 to +15 db compared to the receive gain. two external capacitors c gar (connected between gar and qr) and c gars (connected between gar and gnd) ensure stability. the c gar capacitor provides a first-order low-pass filter. the cut-off frequency corresponds to the time constant c gar r e2 . the relationship c gars 3 10 c gar must be satisfied. the earpiece amplifier has a rail-to-rail output (qr) biased at a voltage of two diodes. it is designed for use with low ohmic (real) loads of 150 w , or capacitive loads of 100 nf in series with 100 w . agc (pin agc) the tea1098 performs automatic line loss compensation, which fits well with the true line attenuation. the automatic gain control varies the gain of some transmit and receive amplifiers in accordance with the dc line current. the control range is 6.45 db for g v(mic-ln) and g v(ir-reco), and 6.8 db for g v(hftx-ln) , which corresponds approximately to a line length of 5.5 km for a 0.5 mm twisted-pair copper cable. to enable this gain control, the pin agc must be shorted to pin ln. the start current for compensation corresponds to a line current of typically 23 ma and a stop current of 57 ma. the start current can be increased by connecting an external resistor between pins agc and ln. it can be increased by up to 40 ma (using a resistor of typically 80 k w ). the start and stop current will be maintained at a ratio of 2.5. by leaving the agc pin open, the gain control is disabled and no line loss compensation occurs. handsfree application figure 7 shows a loop is formed by the sidetone network in the line interface section, and by the acoustic coupling between loudspeaker and microphone in the handsfree section. a loop-gain of greater than 1 causes howl. to prevent howl in full duplex applications, the loop-gain must be set much lower than 1. this is achieved by the duplex controller which detects the channel with the largest signal and controls the gains of the microphone and the loudspeaker amplifiers so that the sum of their gains remains constant. therefore in the handsfree application, the circuit can have three stable modes: 1. transmit mode (tx mode). the microphone amplifier is at maximum gain, and the loudspeaker amplifier is at minimum gain. 2. receive mode (rx mode). the microphone amplifier is at minimum gain, and the loudspeaker amplifier is at maximum gain. 3. idle mode. the microphone amplifier and the loudspeaker amplifier are both midway between maximum and minimum gain. the difference between the maximum and minimum gain is called the switching range.
1999 oct 14 12 philips semiconductors product speci?cation speech and handsfree ic tea1098 handbook, full pagewidth mgm299 duplex control hybrid telephone line sidetone acoustic coupling fig.7 handsfree telephone set principles. h andsfree microphone channel : pins txin, gatx, txout and gndtx (see fig.8) the tea1098 has an asymmetrical handsfree microphone input (txin) with an input resistance of 20 k w . the input dc bias is 0 v. the gain of the input stage varies according to the tea1098 mode. in tx mode, it has maximum gain; in rx mode, it has minimum gain, and in idle mode, it is midway between maximum and minimum gain. switch-over from one mode to the other is smooth and click-free. the output (txout) is biased at a voltage of two diodes and has a current capability of 20 m a (rms). in tx mode, the overall gain of the microphone amplifier (from pins txin to txout) can be adjusted from 0 up to 31 db to suit specific application requirements. the gain is proportional to the value of r gatx and equals 15.2 db when r gatx is 30.1 k w . without output limitation, the microphone input stage can accept signals of up to 18 mv (rms) at 2% thd (room temperature). handbook, full pagewidth mgl342 v i i v c mic v bb r mic txin from voice switch to envelope detector gndtx txout gatx 31 (28) 30 (27) 29 (26) 32 (29) r gatx fig.8 handsfree microphone channel. pin numbers in parenthesis apply to the TEA1098H. pin numbers not in parenthesis apply to the tea1098tv.
1999 oct 14 13 philips semiconductors product speci?cation speech and handsfree ic tea1098 l oudspeaker channel loudspeaker ampli?er: pins hfrx, gals and lsao the tea1098 loudspeaker amplifier has an asymmetrical input with an input resistance of 20 k w between pins hfrx and gnd. it is biased at a voltage of two diodes. without output limitation, the input stage can accept signals of up to 580 mv (rms) at 2% thd (room temperature). the gain of the input stage varies according to the tea1098 mode. in rx mode, it has maximum gain; in tx mode, it has minimum gain and in idle mode, it is halfway between maximum and minimum gain. switch-over from one mode to the other is smooth and click-free. the rail-to-rail output stage is designed to power a loudspeaker connected as a single-ended load (between pins lsao and gnd). in rx mode, the overall gain of the loudspeaker amplifier can be adjusted from 0 up to 35 db to suit specific application requirements. the gain from pin hfrx to pin lsao is proportional to the value of r gals and is 28 db when r gals is 255 k w . it is recommended that a capacitor is connected in parallel with r gals to provide a first-order low-pass filter. volume control: pin vol the loudspeaker amplifier gain can be adjusted by the potentiometer r vol . for logarithmic gain control, a linear potentiometer can be used. each 1.9 k w increase of r vol results in a gain loss of 3 db. the maximum gain reduction using the volume control is internally limited to the switching range (see fig.9). handbook, full pagewidth mgl343 dynamic limiter volume control i v v i dlc lsao gals vol hfrx 14 (11) 15 (12) 12 (8) 5 (1) 26 (23) v bb r gals c gals c lsao c dlc r vol to logic to/from voice switch to envelope detector fig.9 loudspeaker channel. pin numbers in parenthesis apply to the TEA1098H. pin numbers not in parenthesis apply to the tea1098tv. dynamic limiter: pin dlc the tea1098 dynamic limiter prevents clipping of the loudspeaker output stage and protects the operation of the circuit when the supply voltage at v bb falls below 2.7 v. hard clipping of the loudspeaker output stage is prevented by rapidly reducing the gain when the output stage starts to saturate. the time taken to effect gain reduction (clipping attack time) is approximately a few milliseconds. the circuit stays in the reduced gain mode until the peaks of the loudspeaker signals no longer cause saturation. the gain of the loudspeaker amplifier then returns to its normal value within the clipping release time (typically 250 ms). both attack and release times are proportional to the value of the capacitor c dlc . the total harmonic distortion of the loudspeaker output stage, in reduced gain mode, stays below 2% up to 10 db (minimum) of input voltage overdrive [providing v hfrx is below 580 mv (rms)]. when the supply voltage falls below an internal threshold voltage of 2.7 v, the gain of the loudspeaker amplifier is reduced rapidly (approximately 1 ms). when the supply voltage rises above 2.7 v, the gain of the loudspeaker amplifier is increased. by forcing a level lower than 0.2 v on pin dlc, the loudspeaker amplifier is muted and the tea1098 is automatically forced into the tx mode.
1999 oct 14 14 philips semiconductors product speci?cation speech and handsfree ic tea1098 d uplex controller signal and noise envelope detectors: pins tsen, tenv, tnoi, rsen, renv and rnoi the strength of signal level and background noise in both channels is monitored by signal envelope detectors and noise envelope detectors respectively. the outputs of the envelope detectors provide inputs to the decision logic. the signal and noise envelope detectors are shown in fig.10. for the transmit channel, the signal between pin txin and pin tsen is amplified by 40 db. for the receive channel, the signal between pin hfrx and pin rsen is amplified by 0 db. the signals between pin tsen and pin tenv, and between pin rsen and pin renv are logarithmically compressed and buffered. the sensitivity of the envelope detectors is set by resistors r tsen and r rsen . the capacitors connected in series with these two resistors block any dc component and form a first-order high-pass filter. in the basic application, (see fig.19), it is assumed that v txin = 1 mv (rms) and v hfrx = 100 mv (rms) nominal and r tsen and r rsen both have a value of 10 k w . when capacitors c tsen and c rsen both have a value of 100 nf, the cut-off frequency is at 160 hz. the buffer amplifiers feeding the compressed signals to pins tenv and renv have a maximum source current of 120 m a and a maximum sink current of 1 m a. capacitors c tenv and c renv set the timing of both signal envelope detectors. in the basic application, the value of both capacitors is 470 nf. because of the logarithmic compression, each 6 db signal increase means an 18 mv increase on the signal envelopes at pins tenv or renv (room temperature). thus, timings can be expressed in db/ms. at room temperature, the 120 m a sourced current corresponds to a maximum signal envelope rise-slope of 85 db/ms, which is sufficient to track normal speech signals. the 1 m a current sunk by pin tenv or pin renv corresponds to a maximum fall-slope of 0.7 db/ms. this is sufficient for a smooth envelope and also eliminates the effect of echoes on switching behaviour. handbook, full pagewidth mgl344 log 8 (4) 7 (3) 6 (2) 10 (6) 11 (7) 9 (5) log from microphone amplifier from loudspeaker amplifier duplex controller tsen r tsen c tsen c tenv c tnoi r rsen c rsen c renv c rnoi tenv tnoi rsen renv rnoi to logic to logic fig.10 signal and noise envelope detectors. pin numbers in parenthesis apply to the TEA1098H. pin numbers not in parenthesis apply to the tea1098tv.
1999 oct 14 15 philips semiconductors product speci?cation speech and handsfree ic tea1098 to determine the noise level, the signals between pin tenv and pin tnoi, and between pin renv and pin rnoi are buffered. the buffers have a maximum source current of 1 m a and a maximum sink current of 120 m a. capacitors c tnoi and c rnoi set the timing of both noise envelope detectors. in the basic application, see fig.19, the value of both capacitors is 4.7 m f. at room temperature, the 1 m a sourced current corresponds to a maximum noise envelope rise-slope of approximately 0.07 db/ms which is small enough to track background noise without being affected by speech bursts. the 120 m a sink current corresponds to a maximum fall-slope of approximately 8.5 db/ms. however, because the noise envelope tracks the fall of the signal envelope, it will never fall faster than approximately 0.7 db/ms. the behaviour of the signal envelope and noise envelope detectors is illustrated in fig.11. handbook, full pagewidth mbg354 input signal signal envelope noise envelope 4 mv (rms) 1 mv (rms) a c c 36 mv 36 mv b b b a b time a: 85 db/ms b: 0.7 db/ms b: 0.7 db/ms c: 0.07 db/ms fig.11 signal and noise envelope waveforms. decision logic: pins idt and swt the tea1098 selects its mode of operation (tx, rx or idle) by comparing the signal and noise envelopes of both channels. this is executed by the decision logic. the resulting voltage on pin swt is the input to the voice switch. to facilitate the distinction between signal and noise, the signal is considered as speech when its envelope is more than 4.3 db above the noise envelope. at room temperature, this is equal to a voltage difference of v env - v noi = 13 mv. this so called speech/noise threshold is implemented in both channels. the signal on pin txin contains both speech and the acoustically coupled signal from the loudspeaker. in rx mode, the loudspeaker signal overrides the speech. therefore, the signal envelope on pin tenv consists mainly of the loudspeaker signal. to correct this, an attenuator is connected between pin tenv and the tenv/renv comparator. its attenuation is equal to that applied to the microphone amplifier.
1999 oct 14 16 philips semiconductors product speci?cation speech and handsfree ic tea1098 when a dial tone is present on the line, without monitoring, it would be recognized as noise because it has a constant amplitude. this would cause the tea1098 to go into idle mode, and the user would hear the dial tone fade away. to prevent this, a dial tone detector monitors input signals between pins hfrx and gnd. in standard applications, the detector does not consider a signal level above 25 mv (rms) to be noise. this level is proportional to the value of r rsen . similarly, a transmit detector monitors input signals between pins txin and gndtx. in standard applications the detector does not consider a signal level above 0.75 mv (rms) to be noise. this level is proportional to the value of r tsen. figure 12 shows that the output of the decision logic is a current source. the logic table shows the relationship between the input levels and the value of the current source. the current source can charge or discharge the capacitor c swt at a switch-over current of 10 m a. if the current is zero, the voltage on pin swt becomes equal to the voltage on pin idt via the high-ohmic resistor r idt (idling). the resulting voltage difference between pins swt and idt can vary between - 400 and +400 mv and determines the tea1098 mode (see table 1). handbook, full pagewidth mgl345 13 mv 13 mv tenv tnoi renv from logic from dynamic limiter rnoi v dt xx11 - 10 m a + 10 m a + 10 m a x10x 1x0x xx10 0 000x 0 v ref r idt c swt swt 28 (25) 27 (24) (3) 7 (2) 6 (7) 11 (5) 9 idt duplex controller logic (1) attenuator fig.12 decision logic. (1) when dlc < 0.2 v, - 10 m a is forced. pin numbers in parenthesis apply to the TEA1098H. pin numbers not in parenthesis apply to the tea1098tv.
1999 oct 14 17 philips semiconductors product speci?cation speech and handsfree ic tea1098 table 1 tea1098 modes the switch-over timing can be set by capacitor c swt and the idle mode timing can be set by capacitor c swt and resistor r idt . in the basic application given in fig.19, c swt is 220 nf and r idt is 2.2 m w . this enables a switch-over time from tx to rx mode or vice-versa of approximately 13 ms (580 mv swing on pin swt). the switch-over time from idle mode to tx or rx mode is approximately 4 ms (180 mv swing on pin swt). the switch-over time, from rx or tx mode to idle mode is equal to 4 r idt c swt and is approximately 2 seconds (idle mode time). the dlc input overrides the decision logic. when the voltage on pin dlc falls below 0.2 v, the capacitor c swt is discharged by 10 m a which selects tx mode. voice switch: pins stab and swr figure 13 is a diagram of the voice switch. with a voltage on pin swt, the tea1098 voice switch regulates the gains of the transmit and the receive channels so that the sum of both is held constant. in tx mode, the microphone amplifier is at maximum gain and the loudspeaker amplifier is at minimum gain. in rx mode, their gains are the opposite. in idle mode, both microphone and loudspeaker amplifiers are midway between maximum and minimum gain. the difference between the maximum and minimum gain is called the switching range. this range is determined by the ratio of resistors r swr to r stab and is adjustable between 0 and 52 db. resistor r stab should be 3.65 k w which sets an internally used reference current. in the basic application diagram (fig.19), resistor r swr is 365 k w which results in a switching range of 40 db. the switch-over behaviour is illustrated in fig.14. in rx mode, the gain of the loudspeaker amplifier can be reduced using the volume control. at the same time, the gain of the microphone amplifier increases, since the voice switch keeps the sum of the gains constant (see dashed curves in fig.14). however, in tx mode, the volume control has no effect on the gains of the microphone or loudspeaker amplifiers. consequently, the switching range is reduced when the volume is reduced. at maximum reduction of volume, the switching range is 0 db. v swt - v idt (mv) mode < - 180 tx mode 0 idle mode > 180 rx mode ha lfpage g vtx + g vrx = c (1) voice switch r stab r swr stab 24 (21) 25 (22) swr to microphone amplifier from swt from volume control to loudspeaker amplifier duplex controller mgl346 fig.13 voice switch. (1) c = constant. pin numbers in parenthesis apply to the TEA1098H. pin numbers not in parenthesis apply to the tea1098tv. handbook, halfpage - 400 - 200 0 + 400 + 200 g vtx, g vrx v swt - v idt (mv) g vtx r vol ( w ) 11400 7600 idle mode 3800 0 0 3800 7600 11400 (10 db/div) tx mode rx mode g vrx mgm305 fig.14 switch-over behaviour.
1999 oct 14 18 philips semiconductors product speci?cation speech and handsfree ic tea1098 logic inputs table 2 selection of transmit and receive channels for 5 different application modes limiting values in accordance with the absolute maximum rating system (iec 134); all dc levels are referenced to gnd. note 1. mostly dependent on the maximum required ambient temperature, on the voltage between ln and slpe and on the thermal resistance between die ambient temperature. this thermal resistance depends on the application board layout and on the materials used. figure 17 shows the safe operating area versus this thermal resistance for ambient temperature t amb =75 c logic inputs features application examples pd hfc mute 0 x x ?ash, dc dialling 1 0 0 dtmf to ln; dtmf to reco; qr and mics are active dtmf dialling in handset mode 1 0 1 mics to ln; ir to reco; qr and mics are active handset conversation 1 1 0 dtmf to ln; dtmf to reco; hfrx to lsao; qr and mics are active dtmf dialling in handsfree 1 1 1 txin to txout; hftx to ln; ir to reco; hfrx to lsao; mics is active handsfree conversation mode symbol parameter conditions min. max. unit v ln positive continuous line voltage - 0.4 +12 v repetitive line voltage during switch-on or line interruption - 0.4 +13.2 v v n(max) maximum voltage on pins reg, slpe, ir and agc - 0.4 v ln + 0.4 v maximum voltage on all other pins except v dd - 0.4 v bb + 0.4 v i line maximum line current - 130 ma p tot total power dissipation t amb =75 c tea1098tv (see fig.15) - 400 mw TEA1098H (see fig.16) - 720 mw tea1098uh; note 1 -- t stg ic storage temperature - 40 +125 c t amb ambient temperature - 25 +75 c t j junction temperature - 125 c
1999 oct 14 19 philips semiconductors product speci?cation speech and handsfree ic tea1098 thermal characteristics symbol parameter conditions value unit r th(j-a) thermal resistance from junction to ambient in free air tea1098tv 115 k/w TEA1098H 63 k/w tea1098uh tbf by customer in application handbook, full pagewidth 160 0 3.5 9.5 (3) 11.5 i line (ma) 7.5 5.5 120 40 80 13.5 v slpe (v) fca028 (5) (6) (2) (4) (1) line t amb ( c) p tot (mw) (1) 25 800 (2) 35 720 (3) 45 640 (4) 55 560 (5) 65 480 (6) 75 400 fig.15 safe operating area (tea1098tv).
1999 oct 14 20 philips semiconductors product speci?cation speech and handsfree ic tea1098 handbook, full pagewidth 160 0 3 91011 i line (ma) 7 58 6 4 120 40 80 12 v slpe (v) fca029 (1) (2) (5) (3) (4) line t amb ( c) p tot (mw) (1) 35 1304 (2) 45 1158 (3) 55 1012 (4) 65 866 (5) 75 720 fig.16 safe operating area (TEA1098H).
1999 oct 14 21 philips semiconductors product speci?cation speech and handsfree ic tea1098 handbook, full pagewidth 12 160 120 40 0 246 (7) (6) (5) (4) (3) (2) (1) 810 80 fca079 i line (ma) v slpe (v) line r th(j-a) (k/w) (1) 40 (2) 50 (3) 60 (4) 75 (5) 90 (6) 105 (7) 130 fig.17 safe operating area at t amb =75 c (tea1098uh).
1999 oct 14 22 philips semiconductors product speci?cation speech and handsfree ic tea1098 characteristics i line = 15 ma; r slpe =20 w ; z line = 600 w ; f = 1 khz; t amb =25 c for TEA1098H and tea1098tv; t j =25 c for tea1098uh; agc pin connected to ln; pd = high; hfc = low; mute = high; measured according to test circuits; all dc levels are referenced to gnd; unless otherwise speci?ed. symbol parameter conditions min. typ. max. unit supplies l ine interface and internal supply ( pins ln, slpe, reg and v bb ) v slpe stabilized voltage between slpe and gnd i line = 15 ma 3.4 3.7 4 v i line = 70 ma 5.7 6.1 6.5 v v bb regulated supply voltage for internal circuitry i line = 15 ma 2.75 3.0 3.25 v i line = 70 ma 4.9 5.3 5.7 v i line line current for voltage increase start current - 18 - ma stop current - 45 - ma d v slpe(t) stabilized voltage variation with temperature referenced to 25 c t amb = - 25 to +75 c - 60 - mv d v bb(t) regulated voltage variation with temperature referenced to 25 c t amb = - 25 to +75 c - 30 - mv i bb current available on pin v bb in speech mode - 11 - ma in handsfree mode - 9 - ma v ln line voltage i line =1ma - 1.55 - v i line =4ma - 2.35 - v i line = 15 ma 3.7 4.0 4.3 v i line = 130 ma - 8.7 9.5 v s upply for peripherals ( pin v dd ) v dd regulated supply voltage on v dd v bb > 3.35 v + 0.25 v (typ.) 3.1 3.35 3.6 v otherwise - v bb - 0.25 - v d v dd(t) regulated voltage variation with temperature referenced to 25 c t amb = - 25 to +75 c; v bb > 3.35 v + 0.25 v (typ.) - 30 - mv i dd current consumption on v dd in trickle mode; i line = 0 ma; v dd = 1.5 v; v bb discharging - 15 150 na v dd > 3.35 v 60 100 -m a i dd(o) current available for peripherals v dd = 3.35 v -- 3 - ma s upply for microphone ( pin mics) v mics supply voltage for a microphone - 2.0 - v i mics current available on mics -- - 1ma power - down input ( pin pd) v il low-level input voltage - 0.4 - +0.3 v v ih high-level input voltage 1.8 - v bb + 0.4 v i pd input current -- 3 - 6 m a
1999 oct 14 23 philips semiconductors product speci?cation speech and handsfree ic tea1098 i bb(pd) current consumption on v bb during power-down phase pd = low - 460 -m a preampli?er inputs (pins mic+, mic - , ir, dtmf, txin, hftx and hfrx) ? z i(mic) ? input impedance differential between pins mic+ and mic - - 70 - k w single-ended between pins mic+/mic - and gndtx - 35 - k w ? z i(ir) ? input impedance between pins ir and ln - 20 - k w ? z i(dtmf) ? input impedance between pins dtmf and gnd - 20 - k w ? z i(txin) ? input impedance between pins txin and gndtx - 20 - k w ? z i(hftx) ? input impedance between pins hftx and gnd - 20 - k w ? z i(hfrx) ? input impedance between pins hfrx and gnd - 20 - k w tx ampli?ers tx handset microphone amplifier ( pins mic+, mic - and ln) g v(mic-ln) voltage gain from pin mic+/mic - to ln v mic = 5 mv (rms) 43.3 44.3 45.3 db d g v(f) gain variation with frequency referenced to 1 khz f = 300 to 3400 hz - 0.25 - db d g v(t) gain variation with temperature referenced to 25 c t amb = - 25 to +75 c - 0.25 - db cmrr common mode rejection ratio - 80 - db thd total harmonic distortion at ln v ln = 1.4 v (rms) -- 2% i line = 4 ma; v ln = 0.12 v (rms) -- 10 % v no(ln) noise output voltage at pin ln; pins mic+/mic - shorted through 200 w psophometrically weighted (p53 curve) -- 77.5 - dbmp d g v(mute) gain reduction if not activated see table 2 60 80 - db dtmf amplifier ( pins dtmf, ln and reco) g v(dtmf-ln) voltage gain from pin dtmf to ln v dtmf = 50 mv (rms) 24.35 25.35 26.35 db d g v(f) gain variation with frequency referenced to 1 khz f = 300 to 3400 hz - 0.25 - db d g v(t) gain variation with temperature referenced to 25 c t amb = - 25 to +75 c - 0.25 - db d g v(mute) gain reduction if not activated see table 2 60 80 - db symbol parameter conditions min. typ. max. unit
1999 oct 14 24 philips semiconductors product speci?cation speech and handsfree ic tea1098 g v(dtmf-reco) voltage gain from pin dtmf to reco v dtmf = 50 mv (rms) -- 16.5 - db tx amplifier using hftx ( pins hftx and ln) g v(hftx-ln) voltage gain from pin hftx to ln v hftx = 15 mv (rms) 33.5 34.7 35.9 db d g v(f) gain variation with frequency referenced to 1 khz f = 300 to 3400 hz - 0.25 - db d g v(t) gain variation with temperature referenced to 25 c t amb = - 25 to +75 c - 0.25 - db thd total harmonic distortion at ln v ln = 1.4 v (rms) -- 2% v hftx(rms) maximum input voltage at hftx (rms value) i line = 70 ma; thd = 2% - 95 - mv v no(ln) noise output voltage at pin ln; pin hftx shorted to gnd through 200 w in series with 10 m f psophometrically weighted (p53 curve) -- 77.5 - dbmp d g v(mute) gain reduction if not activated see table 2 60 80 - db rx ampli?ers rx amplifiers using ir ( pins ir and reco) g v(ir-reco) voltage gain from pin ir (referenced to ln) to reco v ir = 8 mv (rms) 28.7 29.7 30.7 db d g v(f) gain variation with frequency referenced to 1 khz f = 300 to 3400 hz - 0.25 - db d g v(t) gain variation with temperature referenced to 25 c t amb = - 25 to +75 c - 0.3 - db v ir(rms)(max) maximum input voltage on ir (referenced to ln) (rms value) i line = 70 ma; thd = 2% - 50 - mv v reco(rms)(max) maximum output voltage on reco (rms value) thd = 2% 0.75 0.9 - v v no(reco)(rms) noise output voltage at pin reco; pin ir is an open-circuit (rms value) psophometrically weighted (p53 curve) -- 88 - dbvp d g v(mute) gain reduction if not activated see table 2 60 80 - db rx earpiece amplifier ( pins garx and qr) d g v(reco-qr) gain voltage range between pins reco and qr - 3 - +15 db v qr(rms)(max) maximum output voltage on qr (rms value) sine wave drive; r l = 150 w ; thd < 2% 0.75 0.9 - v v no(qr)(rms) noise output voltage at pin qr; pin ir is an open-circuit (rms value) g v(qr) = 0 db; psophometrically weighted (p53 curve) -- 88 - dbvp symbol parameter conditions min. typ. max. unit
1999 oct 14 25 philips semiconductors product speci?cation speech and handsfree ic tea1098 automatic gain control (pin agc) d g v(trx) gain control range for transmit and receive ampli?ers affected by the agc; with respect to i line =15ma i line = 70 ma; g v(mic-ln) ; g v(ir-reco) 5.45 6.45 7.45 db i line = 70 ma for g v(hftx-ln) 5.8 6.8 7.8 db i start highest line current for maximum gain - 23 - ma i stop lowest line current for maximum gain - 57 - ma logic inputs (pins hfc and mute) v il low-level input voltage - 0.4 - +0.3 v v ih high-level input voltage 1.8 - v bb + 0.4 v i i input current v bb = 3.0 v for pin hfc - 36 m a for pin mute -- 3 - 12 m a handsfree mode (hfc = high) hf microphone amplifier ( pins txin, txout and gatx) g v(txin-txout) voltage gain from pin txin to txout v txin = 3 mv (rms); r gatx = 30.1 k w 12.7 15.2 17.7 db d g v voltage gain adjustment with r gatx - 15 - +16 db d g v(f) gain variation with frequency referenced to 1 khz f = 300 to 3400 hz - 0.1 - db d g v(t) gain variation with temperature referenced to 25 c t amb = - 25 to +75 c - 0.15 - db v no(txout)(rms) noise output voltage at pin txout; pin txin is shorted through 200 w in series with 10 m f to gndtx (rms value) psophometrically weighted (p53 curve) -- 101 - dbmp d g v(mute) gain reduction if not activated see table 2 60 80 - db hf loudspeaker amplifier ( pins hfrx, lsao, gals and vol) g v(hfrx-lsao) voltage gain from pin hfrx to lsao v hfrx = 30 mv (rms); r gals = 255 k w ; i line =70ma 25.5 28 30.5 db d g v voltage gain adjustment with r gals - 28 - +7 db d g v(f) gain variation with frequency referenced to 1 khz f = 300 to 3400 hz - 0.3 - db d g v(t) gain variation with temperature referenced to 25 c t amb = - 25 to +75 c - 0.3 - db d g v(vol) voltage gain variation related to d r vol = 1.9 kw when total attenuation does not exceed the switching range -- 3 - db symbol parameter conditions min. typ. max. unit
1999 oct 14 26 philips semiconductors product speci?cation speech and handsfree ic tea1098 v hfrx(rms)(max) maximum input voltage at pin hfrx (rms value) i line =70ma; r gals =33k w ; for 2% thd in the input stage - 580 - mv v no(lsao)(rms) noise output voltage at pin lsao; pin hfrx is open-circuit (rms value) psophometrically weighted (p53 curve) -- 79 - dbvp d g v(mute) gain reduction if not activated see table 2 60 80 - db v lsao(rms) output voltage (rms value) i bb = 0 ma; i dd =1ma i line =18ma - 0.9 - v i line =30ma - 1.3 - v i line >50ma - 1.6 - v i lsao(max) maximum output current at pin lsao (peak value) 150 300 - ma d ynamic limiter ( pins lsao and dlc) t att attack time when v hfrx jumps from 20 to 20 mv + 10 db -- 5ms when v bb jumps below v bb(th) - 1 - ms t rel release time when v hfrx jumps from 20 mv + 10 db to 20 mv - 100 - ms thd total harmonic distortion v hfrx = 20 mv + 10 db; t>t att - 12% v bb(th) v bb limiter threshold - 2.7 - v m ute receive ( pin dlc) v dlc(th) threshold voltage required on pin dlc to obtain mute receive condition - 0.4 - +0.2 v i dlc(th) threshold current sourced by pin dlc in mute receive condition v dlc = 0.2 v - 100 -m a d g vrx(mute) voltage gain reduction in mute receive condition v dlc = 0.2 v 60 80 - db tx and rx envelope and noise detectors ( pins tsen, tenv, tnoi, rsen, renv and rnoi) preampli?ers g v(tsen) voltage gain from pin txin to tsen - 40 - db g v(rsen) voltage gain from pin hfrx to rsen - 0 - db logarithmic compressor and sensitivity adjustment d v det(tsen) sensitivity detection on pin tsen; voltage change on pin tenv when doubling the current from tsen i tsen = 0.8 to 160 m a - 18 - mv symbol parameter conditions min. typ. max. unit
1999 oct 14 27 philips semiconductors product speci?cation speech and handsfree ic tea1098 d v det(rsen) sensitivity detection on pin rsen; voltage change on pin renv when doubling the current from rsen i rsen = 0.8 to 160 m a - 18 - mv signal envelope detectors i source(env) maximum current sourced from pin tenv or renv - 120 -m a i sink(env) maximum current sunk by pin tenv or renv - 1.25 - 1 - 0.75 m a d v env voltage difference between pins renv and tenv when 10 m a is sourced from both rsen and tsen; signal detectors tracking; note 1 - 3 - mv noise envelope detectors i source(noi) maximum current sourced from pin tnoi or rnoi 0.75 1 1.25 m a i sink(noi) maximum current sunk by pin tnoi or rnoi -- 120 -m a d v noi voltage difference between pins rnoi and tnoi when 5 m a is sourced from both rsen and tsen; noise detectors tracking; note 1 - 3 - mv d ial tone detector v hfrx(th)(rms) threshold level at pin hfrx (rms value) r rsen =10k w- 25 - mv tx level limiter v txin(th)(rms) threshold level at pin txin (rms value) r tsen =10k w- 0.75 - mv d ecision logic ( pins idt and swt) signal recognition d v srx(th) threshold voltage between pins renv and rnoi to switch-over from receive to idle mode v hfrx 1999 oct 14 28 philips semiconductors product speci?cation speech and handsfree ic tea1098 notes 1. corresponds to 1 db tracking. 2. corresponds to 4.3 db noise/speech recognition level. v oice switch ( pins stab and swr) swra switching range - 40 - db d swra switching range adjustment with r swr referenced to 365 k w - 40 - +12 db ?d g v ? voltage gain variation from transmit or receive mode to idle mode - 20 - db g tr gain tracking (g vtx +g vrx ) during switching, referenced to idle mode - 0.5 - db symbol parameter conditions min. typ. max. unit
1999 oct 14 29 philips semiconductors product speci?cation speech and handsfree ic tea1098 this text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the acrobat reader .this text is here in _ white to force landscape pages to be rotated correctly when browsing through the pdf in the acrobat reader.this text is here inthis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the acrobat reader. white to force landscape pages to be ... test and application information b ook, full pagewidth mgl440 c ir 100 nf c emc 10 nf z exch 600 w c exch 100 m f i = 15 ma j_line c imp 100 m f c reg 4.7 m f c vbb 470 m f c vdd 47 m f z imp 620 w v ir v hfrx r slpe 20 w r mic 200 w c dtmf 100 nf r gatx 30.1 k w r lsao 50 w pd hfc mute qr garx reco hfrx gals lsao dtmf gatx txout mic - mic + slpe reg agc ln v bb v dd ir 17 (14) 19 (16) 21 (18) 18 (15) 13 (10) 22 (19) 20 (17) 23 (20) 34 (31) 33 (30) 39 (36) 29 (26) 30 (27) 31 (28) 35 (32) 8 (4) 7 (3) 6 (2) 16 (13) 32 (29) 24 (21) 25 (22) 26 (23) 12 (8) 27 (24) (25) 28 (5) 9 (7) 11 (6) 10 (12) 15 (11) 14 (1) 5 (35) 38 (34) 37 (33) 36 (39) 2 (37) 40 (38) 1 c hftx 100 nf hftx mics c txin 100 nf txin tea1098 c gar 100 pf c gars 1 nf c gals 150 pf c rxe 100 nf c hfrx 100 nf c lsao 220 m f r e2 100 k w r qr 150 w r e1 100 k w r gals 255 k w d z v d = 10 v c mics 4.7 m f c qr 4.7 m f v mic v dtmf v txin v hftx tnoi tenv tsen c tnoi 4.7 m f c tenv 470 nf c tsen 100 nf r tsen 10 k w r stab 3.65 k w r swr 365 k w r vol 0 to 22 k w c dlc 470 nf c swt 220 nf gnd gndtx stab r idt 2.2 m w swr vol dlc swt idt c rnoi 4.7 m f c renv 470 nf c rsen 100 nf r rsen 10 k w rnoi renv rsen fig.18 test configuration. pin numbers in parenthesis apply to the TEA1098H. pin numbers not in parenthesis apply to the tea1098tv.
1999 oct 14 30 philips semiconductors product speci?cation speech and handsfree ic tea1098 this text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the acrobat reader .this text is here in _ white to force landscape pages to be rotated correctly when browsing through the pdf in the acrobat reader.this text is here inthis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the acrobat reader. white to force landscape pages to be ... d book, full pagewidth mgl316 r tx3 8.2 k w r ast1 130 k w r ast2 3.92 k w r bal1 130 w r slpe 20 w c reg 4.7 m f c vbb 470 m f c vdd 47 m f c bal 220 nf r bal2 820 w 15 k w c lsao 220 m f tea1098 gnd gndtx stab r idt 2.2 m w swr vol dlc swt c qr 10 m f idt rnoi renv rsen pd tnoi tenv tsen txin gatx txout hftx mic - mic + mics ir slpe reg agc ln dtmf c dtmf 100 nf c hftx 100 nf c ir 100 nf c txin 100 nf r gatx 30.1 k w z imp 620 w r micp 1 k w c mics 10 m f r bmics 2 k w r micm 1 k w r tx2 392 w r ast3 22 nf c mich 33 nf c emc 10 nf v d = 10 v c imp 22 m f c micb 22 nf c gars 1 nf c tx2 15 k w r tx1 22 nf c tx1 handset micro handsfree micro from mics mics v bb v dd hfc mute from microcontroller qr garx reco hfrx gals lsao r e2 100 k w r e1 100 k w r gals 255 k w c gar 100 pf c gals 150 pf c hfrx 100 nf c rxe 100 nf a b d2 d3 d z d1 d4 c tnoi 4.7 m f c tenv 470 nf c tsen 100 nf r tsen 10 k w r stab 3.65 k w r swr 365 k w r vol 0 to 22 k w c dlc 470 nf c swt 220 nf c rnoi 4.7 m f c renv 470 nf c rsen 100 nf r rsen 10 k w 17 (14) 19 (16) 21 (18) 18 (15) 13 (10) 22 (19) 20 (17) 23 (20) 34 (31) 33 (30) 39 (36) 29 (26) 30 (27) 31 (28) 35 (32) 8 (4) 7 (3) 6 (2) 16 (13) 32 (29) 24 (21) 25 (22) 26 (23) 12 (8) 27 (24) (25) 28 (5) 9 (7) 11 (6) 10 (12) 15 (11) 14 (1) 5 (35) 38 (34) 37 (33) 36 (39) 2 (37) 40 (38) 1 fig.19 basic application diagram. pin numbers in parenthesis apply to the TEA1098H. pin numbers not in parenthesis apply to the tea1098tv.
1999 oct 14 31 philips semiconductors product speci?cation speech and handsfree ic tea1098 bonding pad locations for tea1098uh all x/y coordinates represent the position of the centre of the pad (in m m) with respect to the origin (x/y = 0/0) of the die (see fig.20). the size of all pads is 80 m m 2 . symbol pad coordinates xy hfrx 1 81.5 3597.5 tnoi 2 81.5 3402.2 tenv 3 81.5 3187 tsen 4 81.5 2964.2 rnoi 5 81.5 2746 rsen 6 81.5 2511.8 renv 7 81.8 2282.8 dlc 8 81.5 1972.8 n.c. 9 81.5 1499.8 v bb 10 81.5 1023 gals 11 81.5 589.5 lsao 12 129.2 100.8 n.c. 13 345.2 100.8 gnd 14 805.5 100.8 gnd 15 1069 100.8 slpe 16 1299.2 100.8 ln 17 1488.5 100.8 reg 18 1648.8 100.8 ir 19 1832.8 100.8 agc 20 2028 100.8 v dd 21 2195 101 mics 22 2393.5 101.5 stab 23 2586.5 101.5 swr 24 2778.8 101.5 vol 25 2969 144 swt 26 2969 379.8 idt 27 2969 681.5 txout 28 2969 1086 gatx 29 2969 1342.2 txin 30 2969 1961.2 gndtx 31 2969 2152 gndtx 32 2968.8 2344.2 mic - 33 2968.8 2522.8 mic+ 34 2968.5 2837.2 dtmf 35 2968.5 3062.5 qr 36 2968.5 3499.8 garx 37 2890 3712.8 reco 38 2572 3712.8 hftx 39 2290.8 3712.8 hfc 40 2051.8 3712.8 pd 41 1798.2 3712.8 mute 42 1544.8 3712.8 n.c. 43 1296.8 3712.8 n.c. 44 861 3712.8 n.c. 45 657.2 3712.8 n.c. 46 459.5 3712.8 n.c. 47 255 3712.8 symbol pad coordinates xy
1999 oct 14 32 philips semiconductors product speci?cation speech and handsfree ic tea1098 handbook, halfpage fca078 r6621r die identifier tea1098uh x y 0 0 12 47 46 45 44 43 42 41 40 39 38 37 1 2 3 4 5 6 7 8 9 10 11 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 fig.20 tea1098uh bonding pad locations.
1999 oct 14 33 philips semiconductors product speci?cation speech and handsfree ic tea1098 package outlines unit a 1 a 2 a 3 b p cd (1) e (2) z (1) eh e ll p qy w v q references outline version european projection issue date iec jedec eiaj mm inches 0.3 0.1 2.45 2.25 0.25 0.42 0.30 0.22 0.14 15.6 15.2 7.6 7.5 0.762 2.25 12.3 11.8 1.15 1.05 0.6 0.3 7 0 o o 0.1 0.1 dimensions (inch dimensions are derived from the original mm dimensions) notes 1. plastic or metal protrusions of 0.4 mm maximum per side are not included. 2. plastic interlead protrusions of 0.25 mm maximum per side are not included. 1.7 1.5 sot158-1 92-11-17 95-01-24 x w m q a a 1 a 2 b p d h e l p q detail x e z e c l v m a (a ) 3 a y 40 20 21 1 pin 1 index 0.012 0.004 0.096 0.089 0.017 0.012 0.0087 0.0055 0.61 0.60 0.30 0.29 0.03 0.089 0.48 0.46 0.045 0.041 0.024 0.012 0.004 0.2 0.008 0.004 0.067 0.059 0.010 0 5 10 mm scale vso40: plastic very small outline package; 40 leads sot158-1 a max. 2.70 0.11
1999 oct 14 34 philips semiconductors product speci?cation speech and handsfree ic tea1098 unit a 1 a 2 a 3 b p ce (1) eh e ll p z y w v q references outline version european projection issue date iec jedec eiaj mm 0.25 0.05 1.85 1.65 0.25 0.40 0.20 0.25 0.14 10.1 9.9 0.8 1.3 12.9 12.3 1.2 0.8 10 0 o o 0.15 0.1 0.15 dimensions (mm are the original dimensions) note 1. plastic or metal protrusions of 0.25 mm maximum per side are not included. 0.95 0.55 sot307-2 95-02-04 97-08-01 d (1) (1) (1) 10.1 9.9 h d 12.9 12.3 e z 1.2 0.8 d e e b 11 c e h d z d a z e e v m a x 1 44 34 33 23 22 12 y q a 1 a l p detail x l (a ) 3 a 2 pin 1 index d h v m b b p b p w m w m 0 2.5 5 mm scale qfp44: plastic quad flat package; 44 leads (lead length 1.3 mm); body 10 x 10 x 1.75 mm sot307-2 a max. 2.10
1999 oct 14 35 philips semiconductors product speci?cation speech and handsfree ic tea1098 soldering introduction to soldering surface mount packages this text gives a very brief insight to a complex technology. a more in-depth account of soldering ics can be found in our data handbook ic26; integrated circuit packages (document order number 9398 652 90011). there is no soldering method that is ideal for all surface mount ic packages. wave soldering is not always suitable for surface mount ics, or for printed-circuit boards with high population densities. in these situations reflow soldering is often used. re?ow soldering reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. typical reflow peak temperatures range from 215 to 250 c. the top-surface temperature of the packages should preferable be kept below 230 c. wave soldering conventional single wave soldering is not recommended for surface mount devices (smds) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. to overcome these problems the double-wave soldering method was specifically developed. if wave soldering is used the following conditions must be observed for optimal results: use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. for packages with leads on two sides and a pitch (e): C larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; C smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves at the downstream end. for packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves downstream and at the side corners. during placement and before soldering, the package must be fixed with a droplet of adhesive. the adhesive can be applied by screen printing, pin transfer or syringe dispensing. the package can be soldered after the adhesive is cured. typical dwell time is 4 seconds at 250 c. a mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. manual soldering fix the component by first soldering two diagonally-opposite end leads. use a low voltage (24 v or less) soldering iron applied to the flat part of the lead. contact time must be limited to 10 seconds at up to 300 c. when using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 c.
1999 oct 14 36 philips semiconductors product speci?cation speech and handsfree ic tea1098 suitability of surface mount ic packages for wave and re?ow soldering methods notes 1. all surface mount (smd) packages are moisture sensitive. depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). for details, refer to the drypack information in the data handbook ic26; integrated circuit packages; section: packing methods . 2. these packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. if wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. the package footprint must incorporate solder thieves downstream and at the side corners. 4. wave soldering is only suitable for lqfp, tqfp and qfp packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. wave soldering is only suitable for ssop and tssop packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. package soldering method wave reflow (1) bga, lfbga, sqfp, tfbga not suitable suitable hlqfp, hsqfp, hsop, htqfp, htssop, sms not suitable (1) suitable plcc (3) , so, soj suitable suitable lqfp, qfp, tqfp not recommended (3)(4) suitable ssop, tssop, vso not recommended (5) suitable
1999 oct 14 37 philips semiconductors product speci?cation speech and handsfree ic tea1098 definitions life support applications these products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify philips for any damages resulting from such improper use or sale. bare die disclaimer all die are tested and are guaranteed to comply with all data sheet limits up to the point of wafer sawing for a period of ninety (90) days from the date of philips' delivery. if there are data sheet limits not guaranteed, these will be separately indicated in the data sheet. there is no post waffle pack testing performed on individual die. although the most modern processes are utilized for wafer sawing and die pick and place into waffle pack carriers, philips semiconductors has no control of third party procedures in the handling, packing or assembly of the die. accordingly, philips semiconductors assumes no liability for device functionality or performance of the die or systems after handling, packing or assembly of the die. it is the responsibility of the customer to test and qualify their application in which the die is used. data sheet status objective speci?cation this data sheet contains target or goal speci?cations for product development. preliminary speci?cation this data sheet contains preliminary data; supplementary data may be published later. product speci?cation this data sheet contains ?nal product speci?cations. limiting values limiting values given are in accordance with the absolute maximum rating system (iec 134). stress above one or more of the limiting values may cause permanent damage to the device. these are stress ratings only and operation of the device at these or at any other conditions above those given in the characteristics sections of the speci?cation is not implied. exposure to limiting values for extended periods may affect device reliability. application information where application information is given, it is advisory and does not form part of the speci?cation.
1999 oct 14 38 philips semiconductors product speci?cation speech and handsfree ic tea1098 notes
1999 oct 14 39 philips semiconductors product speci?cation speech and handsfree ic tea1098 notes
? philips electronics n.v. sca all rights are reserved. reproduction in whole or in part is prohibited without the prior written consent of the copyright owne r. the information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. no liability will be accepted by the publisher for any consequence of its use. publication thereof does not con vey nor imply any license under patent- or other industrial or intellectual property rights. internet: http://www.semiconductors.philips.com 1999 68 philips semiconductors C a worldwide company for all other countries apply to: philips semiconductors, international marketing & sales communications, building be-p, p.o. box 218, 5600 md eindhoven, the netherlands, fax. +31 40 27 24825 argentina: see south america australia: 3 figtree drive, homebush, nsw 2140, tel. +61 2 9704 8141, fax. +61 2 9704 8139 austria: computerstr. 6, a-1101 wien, p.o. box 213, tel. +43 1 60 101 1248, fax. +43 1 60 101 1210 belarus: hotel minsk business center, bld. 3, r. 1211, volodarski str. 6, 220050 minsk, tel. +375 172 20 0733, fax. +375 172 20 0773 belgium: see the netherlands brazil: see south america bulgaria: philips bulgaria ltd., energoproject, 15th floor, 51 james bourchier blvd., 1407 sofia, tel. +359 2 68 9211, fax. +359 2 68 9102 canada: philips semiconductors/components, tel. +1 800 234 7381, fax. +1 800 943 0087 china/hong kong: 501 hong kong industrial technology centre, 72 tat chee avenue, kowloon tong, hong kong, tel. +852 2319 7888, fax. +852 2319 7700 colombia: see south america czech republic: see austria denmark: sydhavnsgade 23, 1780 copenhagen v, tel. +45 33 29 3333, fax. +45 33 29 3905 finland: sinikalliontie 3, fin-02630 espoo, tel. +358 9 615 800, fax. +358 9 6158 0920 france: 51 rue carnot, bp317, 92156 suresnes cedex, tel. +33 1 4099 6161, fax. +33 1 4099 6427 germany: hammerbrookstra?e 69, d-20097 hamburg, tel. +49 40 2353 60, fax. +49 40 2353 6300 hungary: see austria india: philips india ltd, band box building, 2nd floor, 254-d, dr. annie besant road, worli, mumbai 400 025, tel. +91 22 493 8541, fax. +91 22 493 0966 indonesia: pt philips development corporation, semiconductors division, gedung philips, jl. buncit raya kav.99-100, jakarta 12510, tel. +62 21 794 0040 ext. 2501, fax. +62 21 794 0080 ireland: newstead, clonskeagh, dublin 14, tel. +353 1 7640 000, fax. +353 1 7640 200 israel: rapac electronics, 7 kehilat saloniki st, po box 18053, tel aviv 61180, tel. +972 3 645 0444, fax. +972 3 649 1007 italy: philips semiconductors, via casati, 23 - 20052 monza (mi), tel. +39 039 203 6838, fax +39 039 203 6800 japan: philips bldg 13-37, kohnan 2-chome, minato-ku, tokyo 108-8507, tel. +81 3 3740 5130, fax. +81 3 3740 5057 korea: philips house, 260-199 itaewon-dong, yongsan-ku, seoul, tel. +82 2 709 1412, fax. +82 2 709 1415 malaysia: no. 76 jalan universiti, 46200 petaling jaya, selangor, tel. +60 3 750 5214, fax. +60 3 757 4880 mexico: 5900 gateway east, suite 200, el paso, texas 79905, tel. +9-5 800 234 7381, fax +9-5 800 943 0087 middle east: see italy netherlands: postbus 90050, 5600 pb eindhoven, bldg. vb, tel. +31 40 27 82785, fax. +31 40 27 88399 new zealand: 2 wagener place, c.p.o. box 1041, auckland, tel. +64 9 849 4160, fax. +64 9 849 7811 norway: box 1, manglerud 0612, oslo, tel. +47 22 74 8000, fax. +47 22 74 8341 pakistan: see singapore philippines: philips semiconductors philippines inc., 106 valero st. salcedo village, p.o. box 2108 mcc, makati, metro manila, tel. +63 2 816 6380, fax. +63 2 817 3474 poland : al.jerozolimskie 195 b, 02-222 warsaw, tel. +48 22 5710 000, fax. +48 22 5710 001 portugal: see spain romania: see italy russia: philips russia, ul. usatcheva 35a, 119048 moscow, tel. +7 095 755 6918, fax. +7 095 755 6919 singapore: lorong 1, toa payoh, singapore 319762, tel. +65 350 2538, fax. +65 251 6500 slovakia: see austria slovenia: see italy south africa: s.a. philips pty ltd., 195-215 main road martindale, 2092 johannesburg, p.o. box 58088 newville 2114, tel. +27 11 471 5401, fax. +27 11 471 5398 south america: al. vicente pinzon, 173, 6th floor, 04547-130 s?o paulo, sp, brazil, tel. +55 11 821 2333, fax. +55 11 821 2382 spain: balmes 22, 08007 barcelona, tel. +34 93 301 6312, fax. +34 93 301 4107 sweden: kottbygatan 7, akalla, s-16485 stockholm, tel. +46 8 5985 2000, fax. +46 8 5985 2745 switzerland: allmendstrasse 140, ch-8027 zrich, tel. +41 1 488 2741 fax. +41 1 488 3263 taiwan: philips semiconductors, 6f, no. 96, chien kuo n. rd., sec. 1, taipei, taiwan tel. +886 2 2134 2886, fax. +886 2 2134 2874 thailand: philips electronics (thailand) ltd., 209/2 sanpavuth-bangna road prakanong, bangkok 10260, tel. +66 2 745 4090, fax. +66 2 398 0793 turkey: yukari dudullu, org. san. blg., 2.cad. nr. 28 81260 umraniye, istanbul, tel. +90 216 522 1500, fax. +90 216 522 1813 ukraine : philips ukraine, 4 patrice lumumba str., building b, floor 7, 252042 kiev, tel. +380 44 264 2776, fax. +380 44 268 0461 united kingdom: philips semiconductors ltd., 276 bath road, hayes, middlesex ub3 5bx, tel. +44 208 730 5000, fax. +44 208 754 8421 united states: 811 east arques avenue, sunnyvale, ca 94088-3409, tel. +1 800 234 7381, fax. +1 800 943 0087 uruguay: see south america vietnam: see singapore yugoslavia: philips, trg n. pasica 5/v, 11000 beograd, tel. +381 11 62 5344, fax.+381 11 63 5777 printed in the netherlands 465002/04/pp 40 date of release: 1999 oct 14 document order number: 9397 750 06403

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